Title:
素材切断装置、及び素材切断システム
Document Type and Number:
Japanese Patent JP6681513
Kind Code:
B2
Abstract:
The present invention provides an apparatus for cutting a material, comprising : a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irradiating a laser beam onto the material before being conveyed to the cutting means; and a blocking and reflection means for blocking the laser beams reflected to the cutting means and re-reflecting the laser beam to the material.
Inventors:
Ho, Hyun-Jun
Im, Chun-su
Kak, Song-Jun
Im, Chun-su
Kak, Song-Jun
Application Number:
JP2019500787A
Publication Date:
April 15, 2020
Filing Date:
July 11, 2017
Export Citation:
Assignee:
POSCO
International Classes:
B23D33/00; B21B15/00; B23D19/06
Domestic Patent References:
| JP2011210915A | ||||
| JP63238991A | ||||
| JP5212572A | ||||
| JP2013035069A | ||||
| JP2012106325A | ||||
| JP2017177322A | ||||
| JP2012130969A | ||||
| JP2000127090A |
Foreign References:
| WO2014050467A1 | ||||
| US20150190886 | ||||
| US20040104207 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Yuko Hara
Masakazu Ito
Yuko Hara