Title:
冷却器及びその製造方法
Document Type and Number:
Japanese Patent JP6708498
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cooler having a high cooling performance, and a manufacturing method thereof.SOLUTION: A cooler 30 comprises: a wiring layer 1 including a mounting surface 20; and a cooling member that is disposed at a lower side of the wiring layer 1. The wiring layer 1 is formed from a composite material of aluminum and carbon particles. In the wiring layer 1, a portion lower than a predetermined pyrogenic element mounting region 21 on the mounting surface 20 is defined as an element lower part 2 and in the wiring layer 1, the other portion than the element lower part 2 is defined as a wiring layer main body part 3. When heat conductivity in the element lower part 2 in a plane direction P is defined as λ1, heat conductivity in the element lower part 2 in a downward direction Q is defined as λ2, heat conductivity in the wiring layer main body part 3 in the plane direction P is defined as λ3 and heat conductivity in the wiring layer main body part 3 in the downward direction Q is defined as λ4, λ1, λ2, λ3 and λ4 satisfy both a formula 1 of λ1≤λ3 and a formula 2 of λ2>λ4.SELECTED DRAWING: Figure 3
Inventors:
Kazuhiko Minami
Application Number:
JP2016135164A
Publication Date:
June 10, 2020
Filing Date:
July 07, 2016
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
H01L23/36; H01L23/12; H01L23/373; H05K1/02; H05K7/20
Domestic Patent References:
| JP2011222669A | ||||
| JP2000150743A | ||||
| JP2001284701A | ||||
| JP2009043981A | ||||
| JP2013008940A | ||||
| JP2015025158A | ||||
| JP2000085697A | ||||
| JP2000315755A |
Foreign References:
| US20120168206 | ||||
| CN102593100A |
Attorney, Agent or Firm:
Yoshihito Shimizu
Hisayoshi Shimizu
Ken Takada
Hisayoshi Shimizu
Ken Takada