Title:
センサーパッチを備えるタイヤセンサー設置構造の製造方法
Document Type and Number:
Japanese Patent JP6762204
Kind Code:
B2
Abstract:
The present invention relates to a structure for installing a sensor module on a tire and a method of manufacturing the structure. The structure includes: a sensor module housing accommodating the sensor module; and one or more sensor patch having a bonding portion that is attached to the inner side of a tire and a pressing portion that brings and maintains the sensor module housing in close contact with an installation position, in which the pressing portion presses down the top of the sensor module housing by extending and contracting. Accordingly, the structure has the advantage of conveniently mounting and separating a sensor module, being applicable to various sensors and various positions, and improving reliability of mounting the sensor module.
More Like This:
| JPS589805 | 【考案の名称】空気圧標示装置 |
| WO/2007/113252 | DEVICE FOR FIXING A MODULE ON THE INNER WALL OF A TYRE |
| WO/2020/126646 | METHOD AND SYSTEM FOR MONITORING A TIRE DURING THE RUNNING OF A VEHICLE |
Inventors:
Seo, Sun Hong
Kim, John Hong
Kim, John Hong
Application Number:
JP2016220972A
Publication Date:
September 30, 2020
Filing Date:
November 11, 2016
Export Citation:
Assignee:
HANKOOK TIRE & TECHNOLOGY CO., LTD.
International Classes:
B60C23/04; B60C19/00
Domestic Patent References:
| JP2007513820A | ||||
| JP2007331293A | ||||
| JP200935242A | ||||
| JP2005178761A | ||||
| JP2012144246A |
Foreign References:
| DE102006027918A1 | ||||
| DE102007008043A1 | ||||
| US20060220816 | ||||
| DE102005024256A1 | ||||
| US6518877 |
Attorney, Agent or Firm:
Hitoshi Shinbo