Title:
水性銅めっき浴および基板上での銅または銅合金の析出方法
Document Type and Number:
Japanese Patent JP6790075
Kind Code:
B2
Abstract:
The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
Inventors:
Heiko Brunner
Lars Coleman
Agnieszka Vicak
Olivier Mann
Lars Coleman
Agnieszka Vicak
Olivier Mann
Application Number:
JP2018510935A
Publication Date:
November 25, 2020
Filing Date:
August 30, 2016
Export Citation:
Assignee:
Atotech Deutschland GmbH
International Classes:
C25D3/38; C25D3/58; C25D7/00
Domestic Patent References:
| JP2013503968A | ||||
| JP2016503461A |
Foreign References:
| CN104630841A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima