Title:
研磨パッド
Document Type and Number:
Japanese Patent JP6842029
Kind Code:
B2
Abstract:
SOLUTION: To suppress a scratch by properly holding slurry between a polishing surface and a polished body.EFFECT: A polishing pad 8 has a polishing layer 4 formed of a fabric structure formed by regularly weaving warp yarns Lv and weft yarns Lh formed of one fiber or by bundling a plurality of fibers, and the warp yarns Lv and weft yarns Lh are formed of acetate fibers having an official moisture percentage of 4-10%, the acetate fibers having an acetylation degree of 45 or more to less than 60%.SELECTED DRAWING: Figure 2
More Like This:
| JP2000232082 | POLISHING PAD AND APPARATUS |
| JP7181009 | Controlled dwell CMP polishing method |
| JP2022057474 | POLISHING PAD |
Inventors:
Naoya Tama
Application Number:
JP2016067386A
Publication Date:
March 17, 2021
Filing Date:
March 30, 2016
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/24; H01L21/304
Domestic Patent References:
| JP2010064216A | ||||
| JP2002009025A | ||||
| JP2003089048A | ||||
| JP2010029995A | ||||
| JP2011143533A |
Foreign References:
| US20030013397 |
Attorney, Agent or Firm:
Makoto Kanzaki
Shinichiro Kanzaki
Shinichiro Kanzaki