Title:
圧力センサおよびその製造方法
Document Type and Number:
Japanese Patent JP6865223
Kind Code:
B2
Abstract:
A pressure sensor according to one embodiment can comprise: a sensor housing including a fastening part fastened to an object for which pressure is measured, and a housing pathway penetrating the fastening part so as to guide a fluid introduced from the pressure measurement target; and a sensor header including a port fixed to the housing pathway by an indentation method, a header pathway penetrating the port so as to guide the fluid introduced from the housing pathway, and a diaphragm located at an end part of the header pathway.
Inventors:
Kim, Yeong Dok
Application Number:
JP2018533916A
Publication Date:
April 28, 2021
Filing Date:
December 28, 2016
Export Citation:
Assignee:
Tyco Electronics AMP Korea Co.,Ltd
International Classes:
G01L19/00; H01L29/84
Domestic Patent References:
| JP2008185349A |
Foreign References:
| CN203616040U | ||||
| DE10302281A1 |
Attorney, Agent or Firm:
Mitsuru Oba
Horikawa Miyuki
Yuko Otake
Yamashita Seiko
Horikawa Miyuki
Yuko Otake
Yamashita Seiko