Title:
有機電子装置の製造方法
Document Type and Number:
Japanese Patent JP6866472
Kind Code:
B2
Abstract:
The present application relates to a method for preparing an organic electronic device, and the organic electronic device prepared by the same, the method for preparing an organic electronic device can improve flatness and adhesion of an organic layer in a process of sealing an organic electronic element to effectively block moisture or oxygen from the outside, thereby securing the lifetime of the organic electronic device.
Inventors:
Kuk Hyun Choi
Jun Hyun Kim
Yoo Jin Woo
Mi Im Yoo
Jun Hyun Kim
Yoo Jin Woo
Mi Im Yoo
Application Number:
JP2019510606A
Publication Date:
April 28, 2021
Filing Date:
December 11, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H05B33/10; H01L21/56; H01L23/29; H01L23/31; H01L51/50; H05B33/04
Domestic Patent References:
| JP2009047879A | ||||
| JP2013165023A | ||||
| JP2014533376A | ||||
| JP2012216950A | ||||
| JP2015220179A | ||||
| JP2011187273A |
Foreign References:
| WO2005019299A1 | ||||
| US20030218422 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe