基板処理方法及び基板処理装置 - 東京エレクトロン株式会社

Title:

基板処理方法及び基板処理装置

Document Type and Number:

Japanese Patent JP6925214

Kind Code:

B2

Abstract:

A substrate processing method includes supplying processing gas from a plurality of gas holes formed along a longitudinal direction of an injector, which extends in a vertical direction along an inner wall surface of a processing container and is rotatable around a rotational axis extending in the vertical direction, to perform a predetermined process on a substrate accommodated in the processing container. The predetermined process includes a plurality of operations, and a supply direction of the processing gas is changed by rotating the injector in accordance with the operations.

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Inventors:

Fukushima Kohei

Application Number:

JP2017182928A

Publication Date:

August 25, 2021

Filing Date:

September 22, 2017

Export Citation:

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Assignee:

東京エレクトロン株式会社

International Classes:

H01L21/31; C23C16/42; C23C16/455

Domestic Patent References:

JP2011029441A
JP2011176081A
JP2015018879A

Foreign References:

US4263872
KR20160113977A

Attorney, Agent or Firm:

Tadashige Ito
Tadahiko Ito

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