熱閉塞体を備える静電チャック

Title:

熱閉塞体を備える静電チャック

Document Type and Number:

Japanese Patent JP6930826

Kind Code:

B2

Abstract:

Apparatuses, systems, and techniques for providing enhanced electrostatic chucks are provided. Such apparatuses, systems, and techniques may include, for example, a common RF and DC electrode in an electrostatic chuck, connection, at a location external to a semiconductor processing chamber, of a high-voltage DC power source and a high-voltage RF power source to a common conductive pathway leading to an electrostatic chuck in the interior of the semiconductor processing chamber, a very thin dielectric layer located on an upper surface of an electrostatic chuck, and/or an axial thermal choke that may be used to control heat flow within an electrostatic chuck.

Inventors:

Maolin Long
Alex patterson
In Woo
Chuen Chau

Application Number:

JP2016195343A

Publication Date:

September 01, 2021

Filing Date:

October 03, 2016

Export Citation:

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