Title:
粘着フィルム
Document Type and Number:
Japanese Patent JP7244198
Kind Code:
B2
Abstract:
The present invention relates to an adhesive film having a silicone adhesive layer on one surface or both surfaces of a substrate film, wherein a silicone adhesive material froming the silicone adhesive layer has 120 to 380% of an elongation at break (tensile speed of 300 mm/min, temperature of 25°C) specified in JIS K 6251, and 1.8×105 to 4.5×105 Pa of a shear storage modulus (frequency of 10 Hz, temperature of 25°C). The adhesive film according to the present invention has good wettability to the surface of an adherend and can be easily attached without creating air bubbles, to the extent that, even if air bubbles are created, the air bubbles can be easily dissipated, and further, even though the adhesive film is generally not easily peeled, peeling is possible with a small a dhesive force during high speed peeling.
Inventors:
Kenichi Hino
Akihiro Nakamura
Michitaka Sudo
English by Tanaka
Akihiro Nakamura
Michitaka Sudo
English by Tanaka
Application Number:
JP2020502860A
Publication Date:
March 22, 2023
Filing Date:
January 22, 2019
Export Citation:
Assignee:
Dow Toray Co., Ltd.
International Classes:
C09J7/38; C09J7/25; C09J11/04; C09J11/06; C09J183/04; C09J183/05; C09J183/07
Domestic Patent References:
| JP2009096817A | ||||
| JP2003313516A | ||||
| JP2004189945A | ||||
| JP2004502858A | ||||
| JP5098240A | ||||
| JP2016506992A |