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Title:
放熱部材
Document Type and Number:
Japanese Patent JP7312515
Kind Code:
B2
Abstract:
This heat dissipating member (1) is provided with: a heat dissipating layer (20) having a polymer; and a protective layer (30) stacked on the heat dissipating layer (20). The heat dissipating layer (20) is arranged to be in contact with a counterpart member (9), and has a thermal conductivity of 0.3-3.0 W/mK in the stacking direction. The thermal resistance of the protective layer (30) calculated by equation (1) is 2.0x10-6 to 1.5 x10-2 m2K/W inclusive. (I): Thermal resistance of protective layer = L/k [L: thickness (m) of protective layer in stacking direction, k: thermal conductivity (W/mK) of protective layer in stacking direction]

Inventors:
Zhang Yutong
Satoshi Yoshikawa
Koji Toyama
Kiyoshi Sakai
Toshifumi Makimura
Hiroaki Nakajima
Takashi Miyanaga
Yuji Kawai
Application Number:
JP2018243226A
Publication Date:
July 21, 2023
Filing Date:
December 26, 2018
Export Citation:
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Assignee:
Sumitomo Riko Co., Ltd.
Tokai Kasei Co., Ltd.
International Classes:
H05K7/20; H01L23/36
Domestic Patent References:
JP2015201602A
JP2012153079A
JP201196989A
JP2009178968A
JP201380789A
JP201671108A
Attorney, Agent or Firm:
Shindo element
Michiaki Higashiguchi
Kudo Yuki