Document Type and Number:
Japanese Patent JPH0479338
Kind Code:
B2
Inventors:
SHIDA TAKAFUMI
WATANABE TAKEO
YAMAZAKI SHIRO
SHINKAWA HIROE
SATAKE KEIGO
WATANABE TAKEO
YAMAZAKI SHIRO
SHINKAWA HIROE
SATAKE KEIGO
Application Number:
JP5170085A
Publication Date:
December 15, 1992
Filing Date:
March 15, 1985
Export Citation:
Assignee:
KUREHA CHEMICAL IND CO LTD
International Classes:
A01N43/653; C07C257/22; C07D249/10
Next Patent: HEATER FOR DIE BONDING SEMICONDUCTOR CHIP