PURPOSE: To surely prevent the deterioration of adhesive strength and the deviation of the installing position of a semiconductor chip by heating a lead frame when intermittent intermediate carriage is stopped.
CONSTITUTION: When the intermittent carriage of lead frame supporting members 9 mounted on endless chains 3 and 4 is stopped, a lead frame A on which a semiconductor chip is bonded by conductive paste on the top plane is successively delivered by a delivery mechanism 17 at one edge of both the endless chains 3 and 4. The lead frame supporting members A heats the lead frames A since heating blocks 23, 24 and 25 are ascended and abutted on the bottom plane of the lead frames A when the carriage is stopped while being intermittently carried to the other edge of both the endless chains 3 and 4. Conductive paste is dried and hardened by repeating to heat at a plurality of heating blocks 23, 24 and 25.
NAGATA HIDEFUMI
NAKAMURA NOBUYUKI
