Title:
【発明の名称】電気的導体の修理方法
Document Type and Number:
Japanese Patent JPH05507391
Kind Code:
A
Abstract:
The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
Inventors:
Handford, Edward, Frank
Harvey Chuck, Joseph, Matthew
Intelante, Mario, John
Jackson, Raymond, Allen
Master, Raj, Navin Chandra
Ray, Sugitta, Kumar
Sabrinski, William, Edward
Classic, Thomas, Anthony
Harvey Chuck, Joseph, Matthew
Intelante, Mario, John
Jackson, Raymond, Allen
Master, Raj, Navin Chandra
Ray, Sugitta, Kumar
Sabrinski, William, Edward
Classic, Thomas, Anthony
Application Number:
JP51658391A
Publication Date:
October 21, 1993
Filing Date:
January 25, 1991
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
H01L21/768; H01L23/498; H01L23/52; H01L23/525; H01L21/3205; H01L23/538; H05K3/22; H05K3/00; H05K3/02; H05K3/34; (IPC1-7): H05K3/22; H01L21/3205
Attorney, Agent or Firm:
Koichi Tonmiya (2 outside)