Document Type and Number:
Japanese Patent JPS5723434
Kind Code:
B2
Abstract:
PURPOSE:To eliminate disconnection and decrease in performance and facilitate lead mounting by providing a taper and radius to the end face of electrodes of multiple element semiconductor material, then evaporating a metal to connect the electrodes to the pads on a substrate.
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Application Number:
JP15223975A
Publication Date:
May 18, 1982
Filing Date:
December 19, 1975
Export Citation:
International Classes:
H01L29/41; H01L21/28; H01L31/0264; H01L31/08