Title:
CONNECTING METHOD FOR THIN METAL WIRE
Document Type and Number:
Japanese Patent JPS58155729
Kind Code:
A
Abstract:
PURPOSE:To contrive improvement in connecting property of a thin metal wire with a semiconductor element by a method wherein the thin metal wire is connected by pressing it using the protrusion of a bonding tool and, at the same time, a notched part is formed on the thin metal wire. CONSTITUTION:An Al wire 6 is inserted into the through hole 9 of the bonding tool 8, and the lower end part of the wire 6 is placed in a groove 10a. Under the above condition, the Al wire 6 is connected to the electrode of an element 4 by pressing the tool 8 upon the semiconductor element 4. Then, when the tool 8 is horizontally moved in the direction of a lead 2 after the tool 8 has been moved to the upper part of the tool 8, the Al 6 can be placed in a groove 10b. The lead 2 is lowered to the point of large calibered part 3 under the above state, the part 6b of the Al wire 6 is connected to the large calibered part 3 by pressing the tool 8 onto the large calibered part 3 under the above condition. At the same time, the protrusion 11 in the groove 10b is inroaded the Al wire 6 and a notch 6c is formed. Then, after the tool 8 has been moved upward, the Al 6 is held by a chuck 12. When the chuck 12 is moved upward, the Al wire 6 can be easily cut off by the notch 6c.
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Inventors:
KOIKE CHIHIRO
MURASE MASAYOSHI
MURASE MASAYOSHI
Application Number:
JP3160883A
Publication Date:
September 16, 1983
Filing Date:
February 25, 1983
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Kansai NEC Corporation