Document Type and Number:
Japanese Patent JPWO2020195087
Kind Code:
A1
Abstract:
An adhesive sheet for work processing, which is provided with a base material and an adhesive layer that is superposed on one surface of the base material, and which is configured such that: the base material has a storage elastic modulus of 1,000 MPa or more at 25°C; the adhesive layer is formed of an active energy ray-curable adhesive that is composed of an adhesive composition containing an acrylic polymer wherein an active energy ray-curable group is introduced into a side chain; the acrylic polymer has a glass transition temperature (Tg) of from -80°C to -30°C (inclusive); and the interlaminar strength between the base material and the adhesive layer is 1,000 mN/25 mm or more. This adhesive sheet for work processing is capable of suppressing chipping, and enables good processing of a work.
Application Number:
JP2021508136A
Publication Date:
October 01, 2020
Filing Date:
January 24, 2020
Export Citation:
