Document Type and Number:
Japanese Patent JPWO2021095328
Kind Code:
A1
Abstract:
Provided is an epoxy resin composition having good fluidity, and exhibiting excellent reliability for electronic components such as a semiconductor. The present invention is an epoxy resin composition containing an imidazolium salt (S), an epoxy resin (C), and a curing agent (D), the imidazolium salt (S) comprising an imidazolium cation (A) represented by the general formula (1) and at least one anion (B) selected from the group consisting of an carboxylate anion and a phenoxide anion. [In the formula (1), R1 represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a butyl group; R2 and R3 each represent a methyl group, an ethyl group, a propyl group, or a butyl group, and may be either the same as or different from each other; and R4 and R5 each represent a hydrogen atom, a methyl group, or an ethyl group, and may be either the same as or different from each other.]
Application Number:
JP2021555911A
Publication Date:
May 20, 2021
Filing Date:
September 03, 2020
Export Citation:
Domestic Patent References:
| JP2019014781A | 2019-01-31 | |||
| JP2019523322A | 2019-08-22 | |||
| JP2015209492A | 2015-11-24 | |||
| JP2010529271A | 2010-08-26 |
Foreign References:
| WO2009014270A1 | 2009-01-29 |