Title:
ADHERENT POLYMER COMPOSITION
Document Type and Number:
Japanese Patent JP2000178525
Kind Code:
A
Abstract:
To provide adherent polymer compositions excellent in molding processability and, in addition, excellent in the initial adhesion to a substrate and its heat resistance.
This adherent polymer composition comprises (A) 50-99 wt.% ethylenic polymer having a storage shear modulus (G') by shear strain at 190°C at an angular velocity of 1.00 rad/sec of not less than 200 Pa, a density of 0.850-0.950 g/cm3, a melt flow rate of 0.01-50 g/10 min and (B) 50-1 wt.% tackifier.
Inventors:
IKEDA MUTSUKO
YADA YOSHINOBU
NAKAYAMA HIROYUKI
YADA YOSHINOBU
NAKAYAMA HIROYUKI
Application Number:
JP35881098A
Publication Date:
June 27, 2000
Filing Date:
December 17, 1998
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C09J123/08; C09J153/02; (IPC1-7): C09J123/08; C09J153/02
Attorney, Agent or Firm:
Hasegawa Moji