To improve the reliability of conductive connection in a conductive connection structure in which the connecting terminals of a substrate are conduction connected with the bump electrodes of a semiconductor chip.

An anisotropic conductive adhesive 1 is composed of a product obtained by mixing a number of conductive particles 2a having a large particle diameter and a number of conductive particles 2b having a small particle diameter into an insulating adhesive 3, and even when the space between the surface of a bump electrode 7 and that of a connecting terminal 5 is locally larger than the diameter of conductive particles 2a having a large particle diameter, the presence of conductive particles 2a having a large particle diameter and those 2b having a small particle diameter in contact with one another in a larger spaced region can make conductive connection of bump electrode 7 with connecting terminal 5. On the other hand, in the region where the space between the surface of bump electrode 7 and that of connecting terminal 5 is smaller than the diameter of conductive particles 2a having a large particle diameter, the presence of conductive particles 2a having a small particle diameter therebetween can make conductive connection of bump electrode 7 with connecting terminal 5.