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Title:
ADHERENT RESIN COMPOSITION AND LAMINATED PRODUCT FORMED THEREFROM
Document Type and Number:
Japanese Patent JP2000086840
Kind Code:
A
Abstract:

To provide adherent resin compositions for obtaining laminated products improved in gas barrier properties, mechanical strength, resistance to contents, designing, and the like.

Adherent resin compositions comprise (a) a modified ethylene type polymer modified with 0.01-10 wt.% unsaturated carboxylic acid or a derivative thereof which has an MFR of 0.05-50 g/10 min and a density of 0.880-0.950 g/cm3, (b) a tackifier, and (c) a hydrogenated product of a block copolymer having a vinyl aromatic compound polymer block and a conjugated diene compound polymer block, and meet the formula: Tg1-Tg2≥5 deg (wherein Tg1 is a Tg of the conjugated diene compound polymer block in component (c) by the DSC measurement of the resin composition comprising components (a), (b), and (c); and Tg2 is a Tg of the conjugated diene compound polymer block in the block copolymer by the DSC measurement of component (c) alone, provided that Tg2 ≤-45°C).


Inventors:
IKEDA MUTSUKO
Application Number:
JP25679998A
Publication Date:
March 28, 2000
Filing Date:
September 10, 1998
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
B32B27/32; B32B27/36; C08L23/08; C08L23/26; C08L53/02; C08L57/02; C08L93/04; (IPC1-7): C08L23/26; B32B27/32; B32B27/36; C08L23/08; C08L53/02; C08L57/02; C08L93/04
Attorney, Agent or Firm:
Kazuo Sato (2 outside)