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Title:
ADHESION METHOD USING ADHESIVE COMPRISING MODIFIED SILICONE RESIN
Document Type and Number:
Japanese Patent JP2001192640
Kind Code:
A
Abstract:

To provide an adhesion method where the cure rate of an adhesive comprising a modified silicone resin is accelerated.

An adhesive composition comprising a modified silicone resin, a curing catalyst for the modified silicone resin and inorganic hydraulic powder is incorporated with water and the mixture is applied to an adherend surface. For example, the mixture is applied and should be left to stand when applied to a joint, and other object is pressed against an applied surface of the mixture when the other object is desired to be adhered and joined to the adherend surface. Thus, the inorganic hydraulic powder and water are quickly reacted with each other to be provisorily cured, and then the modified silicone resin, the curing catalyst and damp (moisture) are reacted with one another to be substantially cured. Since the provisory curing quickly occurs, a cure rate is accelerated and sufficient adhesive strength can be realized by the substantial curing. In the case of a two-pack type adhesive, for example, a principal component consisting of the modified silicone resin and water and a curing agent consisting of the inorganic hydraulic powder and the curing catalyst for the modified silicone resin are prepared and homogeneously mixed, and then the mixture is applied to the adherend surface.


Inventors:
HORII KYUICHI
Application Number:
JP2000002111A
Publication Date:
July 17, 2001
Filing Date:
January 11, 2000
Export Citation:
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Assignee:
KONISHI CO LTD
International Classes:
C09J183/04; C09J1/00; C09J5/00; (IPC1-7): C09J183/04; C09J1/00; C09J5/00
Domestic Patent References:
JPH0891900A1996-04-09
JPH07215748A1995-08-15
JPH09503020A1997-03-25
JPH11189759A1999-07-13
JPH08183939A1996-07-16
JPH11349912A1999-12-21
JPH04100882A1992-04-02
Attorney, Agent or Firm:
Okumura Shigeki