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Patent Searching and Data


Title:
HOT-MELT ADHESIVE COMPOSITION AND USE THEREOF
Document Type and Number:
Japanese Patent JP2001192638
Kind Code:
A
Abstract:

To provide a polyamide hot-melt adhesive that has excellent viscosity stability and high skinning resistance and provide a hot-melt adhesive for book binding that can manifest excellent performance, for example, printing ink resistance, heat resistance, durability, page-opening properties and waste paper- recycling properties, in no need of remodeling or renewal of the conventional book-making installation.

In a hot-melt type adhesive composition that contains the polyamide resin derived from a dimmer acid, at least a part of the constitution units from the dimmer acid is hydrogenated among the polyamide resin and pentaerythritol tetrakis (β-lauryl thiopropionate) is formulated as an antioxidant. The objective hot-melt adhesive for book binding includes the above-hot-melt type adhesive composition.


Inventors:
MORIMOTO TAKASHI
NAKAMURA KAZUAKI
TERADA NOBUHITO
MATSUBA YORISHIGE
Application Number:
JP2000006212A
Publication Date:
July 17, 2001
Filing Date:
January 11, 2000
Export Citation:
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Assignee:
NITTA GELATIN KK
HARIMA CHEMICALS INC
International Classes:
B42C9/00; C08G69/34; C09J11/06; C09J177/00; (IPC1-7): C09J177/00; C08G69/34; C09J11/06
Attorney, Agent or Firm:
Takehiko Matsumoto