セラミック基材用接着剤組成物、接着材付きセラミック基材、及び積層体

Japanese Patent JP6969290

B2

PROBLEM TO BE SOLVED: To provide an adhesive composition for a ceramic base material, a ceramic base material with an adhesive, and a laminate.SOLUTION: An adhesive composition for a ceramic base material contains a polyamide-imide (A-1), which is a condensate of an acid component containing a dimer acid derivative (a1) and a tricarboxylic acid anhydride (a2) and a diisocyanate (a3), and an aprotic polar solvent (B). In one embodiment, the composition further contains a methoxy silyl group-containing silane-modified polyamide-imide (A-2), which is a reactant between an epoxy group-containing methoxysilane partial condensate (C) as a demethanolation condensate of an epoxy alcohol (c1) and a methoxysilane partial condensate (c2), with the polyamide-imide (A-1).SELECTED DRAWING: None

JP5994266	A photosensitive resin composition, film adhesive, an adhesion sheet, an adhesives pattern, a semiconductor wafer with an adhesives layer, and a semiconductor device
JP5998762	An adhesive constituent and pressure sensitive adhesive tape
JP4467662	Heat resistant adhesive

Oozaki saki Shin
Hideki Goda

JP2017208918A

November 24, 2021

October 30, 2017

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Arakawa Chemical Industry Co., Ltd.

C09J179/08; B32B18/00; B32B27/34; C08G18/34; C08G18/83; C08G59/40; C08G73/14; C09J11/06

JP2011042730A
JP2009114307A
JP2008208295A
JP2009182073A
JP2001240670A
JP2002146322A
JP2008229866A
JP2004182792A
JP2002212289A

WO2001005862A1

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