Title:
A photosensitive resin composition, film adhesive, an adhesion sheet, an adhesives pattern, a semiconductor wafer with an adhesives layer, and a semiconductor device
Document Type and Number:
Japanese Patent JP5994266
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is excellent in pattern formability, film stability and embedding properties when a film is formed and used, and sufficiently suppresses void formation when being bonded at high temperature, and to provide a film-like adhesive, an adhesive sheet, an adhesive pattern, a semiconductor wafer with an adhesive layer, and a semiconductor device which use the same.SOLUTION: The photosensitive resin composition contains: (A) an alkali-soluble resin having a phenolic hydroxyl group as a terminal group; (B) a radiation polymerizable compound; and (C) a photoinitiator.
Inventors:
Minegishi Tomonori
Mitsukura
Mitsukura
Application Number:
JP2012022121A
Publication Date:
September 21, 2016
Filing Date:
February 03, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
G03F7/037; C09J4/00; C09J7/00; C09J7/02; C09J163/00; C09J179/08; G03F7/004; G03F7/027; G03F7/032
Domestic Patent References:
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Foreign References:
| WO2011001942A1 | ||||
| WO2012005079A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hiroshi Abe
Yoshinori Shimizu
Hiroyuki Hirano
Hiroshi Abe
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