To provide an adhesive composition increasing adhesion between different materials each other by using an adhesive composition containing an organosilicon compound having a potential reactive functional group at the part other than a silicon part, and to provide various materials using the adhesive composition.
The adhesive composition contains an organosilicon compound having a piperazinyl group expressed by general formula (1) (R1 and R2 are a 1-10C unsubstituted or substituted monovalent hydrocarbon group and each may be the same or different; and n is an integer of 0 to 2). According to this invention, by using the adhesive composition containing the organosilicon compound having the piperazinyl group, the adhesion of two or more kinds of different materials is increased, and high mechanical properties and heat resistance can be imparted to a composite material containing them. Further, since the organosilicon compound is made of a single molecule, the composite material can be obtained in which variation in effect upon use is reduced, and which has high reliability.
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Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa