To provide an adhesive composition which excels in processability and flexibility and can improve heat resistance and adhesiveness.

The adhesive composition comprises (A) a modified polyamideimide resin obtained by copolymerizing (a) an aromatic isocyanate compound, (b) an aromatic polycarboxylic anhydride, and (c) a carboxylic acid-terminated polyester having or a carboxylic acid-terminated polyamide, (B) a solvent soluble polyamide resin having a group reactive to the epoxy groups of the following component (C), and (C) an epoxy resin having two or more epoxy groups in the molecule.