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Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2002226817
Kind Code:
A
Abstract:

To obtain an adhesive composition having excellent adhesiveness to various kinds of plastic films, adhesiveness to metals such as copper, aluminum, stainless steel, etc., adhesiveness to glass, heat resistance, solvent resistance, etc.

This adhesive composition is characterized by comprising an epoxy modified polyester (A) obtained by reacting a polyester resin having 5,000-50,000 number-average molecular weight with an epoxy resin containing two or more functional glycidyl groups in one molecule and a polyamide compound (B).


Inventors:
HATSUTORI TAKAHIRO
HACHITSUKA TSUYOSHI
Application Number:
JP2001028586A
Publication Date:
August 14, 2002
Filing Date:
February 05, 2001
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
C09J163/00; C09J167/00; C09J177/06; (IPC1-7): C09J163/00; C09J167/00; C09J177/06