To provide an adhesive for counter electrode connection which has comparatively lower curing temperature, high connection reliability and excellent storage stability.

The adhesive for counter electrode connection contains: component (a) of a binder resin containing a (meth)acrylate compound (a1) and an epoxy resin (a2) having 5,000-70,000 weight-average molecular weight; component (b) of an imidazole-based curing agent of 0.1-5 parts mass based on 100 parts mass component (a); component (c) of an organic peroxide of 1-10 parts mass based on 100 parts mass component (a); and component (d) of water of 0.5-3 parts mass based on 100 parts mass component (a).