Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, AND METHOD OF RECOGNIZING MARK FOR POSITION IDENTIFICATION OF CIRCUIT MEMBER
Document Type and Number:
Japanese Patent JP2009164596
Kind Code:
A
Abstract:
To provide an adhesive film for circuit connection which enables a mark for position identification of a circuit member to be sufficiently recognized by an electromagnetic wave transmitted through an adhesive layer stuck to the circuit member.
An adhesive film 1 for circuit connection includes a film-like support body 2 and an insulating adhesive layer 3, provided in contact with the principal surface 2a of the support body 2, and the principal surface 2a on the side of the adhesive layer 3 of the support body 2 has a center line average roughness Ra of 0.3 m or smaller.
Inventors:
SHINOHARA KENGO
NAGAI AKIRA
TAKEMURA KENZO
WATANABE OSAMU
KAWABATA YASUNORI
NAGAI AKIRA
TAKEMURA KENZO
WATANABE OSAMU
KAWABATA YASUNORI
Application Number:
JP2008317241A
Publication Date:
July 23, 2009
Filing Date:
December 12, 2008
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/32; C09J7/02; C09J201/00; H05K1/14; H05K3/36; H01L23/00
Domestic Patent References:
| JP2005206717A | 2005-08-04 | |||
| JPS57190064A | 1982-11-22 | |||
| JP2005314696A | 2005-11-10 | |||
| JPH08152646A | 1996-06-11 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hideki Okita
Yoshinori Shimizu
Hideki Okita
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