ADHESIVE RESIN COMPOSITION, LAMINATE USING THE SAME, AND FLEXIBLE PRINTED WIRING BOARD

Japanese Patent JP2011219590

A

To provide a composition satisfying requests about solder heat resistance and a flow characteristic after absorbing moisture, while maintaining characteristics required inherently for a flame-retardant adhesive composition for a flexible printed wiring board, such as heat resistance, a separation strength and flexibility.

This adhesive resin composition contains (A) a phosphorus-containing phenoxy resin, (B) a bisphenol S type phenoxy resin, (C) a thermoplastic resins other than the (A) component and the (B) component, and (D) a curing agent reacting with epoxy group and/or hydroxy group in the phenoxy resins, and a content weight ratio (A/B) of the (A) phosphorus containing phenoxy resin to the (B) bisphenol S type phenoxy resin is 80/20-65/35 in the adhesive resin composition.

WO/2006/118323	COMPOSITION CONTAINING FLUORINE-CONTAINING AROMATIC POLYMER AND LAMINATED BODY CONTAINING FLUORINE-CONTAINING AROMATIC POLYMER
JP2002309200	ADHESIVE FILM
JPH11297805	ELECTROSTATIC CHUCKING DEVICE, LAMINATED SHEET AND BONDING AGENT THEREFOR

YONEZAWA TAKAYUKI
KAIMORI SHINGO
SUGAWARA JUN
ASAI SHOGO
KIMURA ATSUSHI

JP2010089247A

November 04, 2011

April 08, 2010

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SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELECTRIC PRINTED CIRCUIT INC

C09J171/10; C08G65/46; C09J163/00; C09J177/00; H05K1/03

Eriko Kamiya
Naoji Shimura

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