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Patent Searching and Data


Title:
ADHESIVE RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2010024341
Kind Code:
A
Abstract:

To provide an adhesive resin having excellent adhesion to a hardly adhering base material with the use of a simple device by an easy method and a composition containing the resin.

The adherent resin composition comprises (1) 100 pts.wt. modified polyolefin resin composition which is obtained by melt kneading a polyolefin resin (a) with an epoxy group-containing vinyl monomer (c) and an aromatic vinyl monomer (d) as essential components and other vinyl monomers (e) as optional components in the presence of a radical polymerization initiator (b) and has a ratio of the epoxy group-containing monomer (c) in 100 wt.% sum of the polyolefin resin (a), the epoxy group-containing monomer (c), the aromatic vinyl monomer (d), and the other vinyl monomers (e) in the range of 0.1-50 wt.% and (2) 0.5-500 pts.wt. olefin copolymer rubber.


Inventors:
MICHINOBU TAKAO
MORO MITSUTOSHI
Application Number:
JP2008187079A
Publication Date:
February 04, 2010
Filing Date:
July 18, 2008
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C09J151/00; B32B27/38; C08F255/02; C09J4/02; C09J7/00; C09J123/00; C09J123/14; C09J123/16; C09J125/00; C09J163/00