To provide a composition for forming protective films, giving the protective films which are excellent in protective film characteristics for protecting wafer-holding surfaces on the processing of wafers and enable to easily peel off discarded protective films without a specific wafer-washing liquid, after used, and to provide a peeling method by which the protective film can be peeled without accompanying an environmental load.

There is provided the composition for forming the protective films, characterized by containing a coating film-forming material (A) comprising at least polyvinylbutyral resin (a) and polyvinylacetoacetal resin (b), and a compound (B) represented by general formula (1) in an organic solvent.