Title:
ADHESIVE SHEET AND METHOD FOR USING THE SAME
Document Type and Number:
Japanese Patent JP2004256595
Kind Code:
A
Abstract:
To provide an adhesive sheet suitably used as a surface-protecting sheet which can sufficiently protect a semiconductor wafer, when or after the backside of the wafer is polished, does not shrink, even when a die-bonding sheet is thermo-compression-bonded to the polished backside, and can therefore minimize the deformation of the wafer.
This adhesive sheet comprising a substrate and an adhesive layer formed on the substrate is characterized by using a substrate having a shrinkage stress of ≤5.0×105 N/m2 measured when heated at 23 to 180°C, held at 180°C for one minute, and then cooled to 23°C, as the substrate.
Inventors:
IZUMI TATSUYA
MIYATA TAKESHI
TAKAHASHI KAZUHIRO
MIYATA TAKESHI
TAKAHASHI KAZUHIRO
Application Number:
JP2003046249A
Publication Date:
September 16, 2004
Filing Date:
February 24, 2003
Export Citation:
Assignee:
LINTEC CORP
International Classes:
C09J7/02; C09J4/00; C09J175/14; H01L21/304; (IPC1-7): C09J7/02; C09J4/00; C09J175/14; H01L21/304
Domestic Patent References:
| JP2004214309A | 2004-07-29 | |||
| JP2003147300A | 2003-05-21 | |||
| JP2002246345A | 2002-08-30 | |||
| JP2003249471A | 2003-09-05 | |||
| JP2003138228A | 2003-05-14 | |||
| JP2003176464A | 2003-06-24 |
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki
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