Title:
再剥離用粘着テープおよびその製造方法
Document Type and Number:
Japanese Patent JP5872798
Kind Code:
B2
Abstract:
Provided is a removable adhesive tape which has with excellent heat resistance and little increase in adhesive force during removal, and which leaves no adhesive residue or contamination on the adherend. This removable adhesive tape is formed from a heat-resistant film substrate and a cured adhesive layer on one surface of said heat-resistant film substrate, wherein the cured adhesive layer is formed by photo-curing an adhesive layer formed from an adhesive composition containing 0.15-4.0 parts by weight of a photo-cationic polymerization initiator per 100 parts by weight of a graft polymer formed by graft polymerization of chains containing cyclic ether group-containing monomers onto a (meth)acrylic polymer.
Inventors:
Azuma Masatsugu
Hiroshi Moroishi
Shigeru Fujita
Inoue Tetsuo
Hiroshi Moroishi
Shigeru Fujita
Inoue Tetsuo
Application Number:
JP2011132389A
Publication Date:
March 01, 2016
Filing Date:
June 14, 2011
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J151/00; C08F265/06; C09J7/22; C09J7/30; C09J11/06; C09J163/00
Domestic Patent References:
| JP2003147311A |
Foreign References:
| WO2010140442A1 | ||||
| WO2011068117A1 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office