Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE FOR THERMAL FUSION BONDING, AND ADHESIVE CLOTH
Document Type and Number:
Japanese Patent JP2005126562
Kind Code:
A
Abstract:

To provide an adhesive for thermal fusion bonding which, even when subjected to high-temperature thermal fusion bonding for a long time, gives an adhesive interlining with sufficient adhesive power.

The adhesive for thermal fusion bonding contains an aqueous thermoplastic resin dispersion and at least one crosslinker; the resin dispersion is prepared by heating a thermoplastic resin to its softening point or higher and dispersing the softened resin in an aqueous medium; and the crosslinker is selected from the group consisting of an epoxy compound, an isocyanate compound, an oxazoline compound, a hydrazide compound, a titanium compound, a zirconium compound, a silane compound, and a carbodiimide compound. The adhesive is thermally fusion bonded to the surface of a base fabric, giving an adhesive cloth.


Inventors:
SUGIHARA NORIHIRO
NAKAO KEIICHIRO
OKAMOTO TADASHI
Application Number:
JP2003363251A
Publication Date:
May 19, 2005
Filing Date:
October 23, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO SEIKA CHEMICALS
International Classes:
C09J7/02; C09J163/00; C09J167/00; C09J175/04; C09J177/00; C09J201/00; (IPC1-7): C09J163/00; C09J7/02; C09J167/00; C09J175/04; C09J177/00; C09J201/00
Domestic Patent References:
JP2000073038A2000-03-07
JP2003194032A2003-07-09
JP3068063B
JP2001026762A2001-01-30
JP2001019937A2001-01-23
JPH09503018A1997-03-25
JPH091730A1997-01-07
JP2003246974A2003-09-05