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Title:
ADSORBENT FILM, ITS MANUFACTURING METHOD, ADSORBENT FILM WITH MOLD RELEASE FILM AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2008036885
Kind Code:
A
Abstract:

To provide an adsorbent film suitable for the buffer material mounted on the adsorbent plate of a mold or the like when a plate-shaped object to be adsorbed easy to deform like a ceramic green sheet is adsorbed.

The adsorbent film is constituted by coating a mold release film 1 with a heated hot melt adhesive, bonding a porous sheet 3 to the adhesive in a state that the adhesive becomes a low temperature to form a laminate wherein the mold release film 1, the pressure-sensitive adhesive layer 2 comprising the hot melt adhesive and the porous sheet 3 are laminated in this order and peeling the mold release film 1 from the laminate to laminate the pressure-sensitive adhesive layer 2 and the porous sheet 3. The porous sheet is composed, for example, of an ultra-high-molecular-weight polyethylene resin porous sheet. For example, the adhesive strength against stainless steel of the pressure-sensitive adhesive layer is 0.8 N/25 mm or above and the air permeability of the pressure-sensitive adhesive layer is 5 cm3/cm2 sec or above.


Inventors:
MORIYAMA JUNICHI
Application Number:
JP2006211311A
Publication Date:
February 21, 2008
Filing Date:
August 02, 2006
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
B32B27/00; B32B7/02; B32B27/30; C09J7/02
Domestic Patent References:
JPH08257474A1996-10-08
JP2005056658A2005-03-03
JP2002173250A2002-06-21
JPH08169971A1996-07-02
JP2003277702A2003-10-02
JP2004160211A2004-06-10
JP2001028390A2001-01-30
Attorney, Agent or Firm:
Koichi Kamata
Shigeru Kuroda