Title:
ALKYLPEROXYMETHYL-SUBSTITUTED BENZOATE, RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2001114757
Kind Code:
A
Abstract:
To develop a peroxide having a proper plate gel time, capable of shortening a rise time in curing a thermosetting resin such as an unsaturated polyester resin or a vinyl ester resin.
This alkylperoxymethyl-substituted benzoate is represented by the formula (R is a 1-5 alkyl group; n is an integer of 1 or 2) and is suitable for a curing agent for a thermosetting resin such as an unsaturated polyester resin or a vinyl ester resin, etc. This polymerization initiator, crosslinking agent or curing agent comprises the compound as an active ingredient. The thermosetting resin composition (molding material) comprises the compound. This thermosetting resin molded product is cured by using the compound.
Inventors:
FUJII SHINICHI
Application Number:
JP28906899A
Publication Date:
April 24, 2001
Filing Date:
October 12, 1999
Export Citation:
Assignee:
KAYAKU NOURY CORP
International Classes:
C07C409/38; C08F4/34; C08F283/01; C08F290/06; C08K5/14; C08L101/00; C08L101/16; (IPC1-7): C07C409/38; C08F4/34; C08F283/01; C08F290/06; C08K5/14; C08L101/16
Attorney, Agent or Firm:
Norio Saeki