Title:
ANISOTROPIC CONDUCTIVE BONDING MATERIAL AND ITS CONNECTING METHOD
Document Type and Number:
Japanese Patent JP3738655
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an anisotropic bonding material for assuring connecting reliability, similar to that in conventional anisotropic conductive connection using a gold bump or a soldering bump, even if a relatively hard bump such as a nickel bump is used for a protruded electrode in anisotropic connection between an electronic element such as a bare IC chip with the protruded electrode and a connection pad for a wiring board.
SOLUTION: For an anisotropic conductive bonding material having conductive particles dispersed in a thermosetting resin, a 10% compression bonding modulus of elasticity (E) of the conductive particles and a vertical modulus of elasticity (E') of the protruded electrode of the electronic element to be connected with the anisotropic conductive bonding material are satisfied with a relational expression, 0.02≤E/E'≤0.5.
Inventors:
Suga Yasuhiro
Motoichi Takeichi
Motoichi Takeichi
Application Number:
JP2000099883A
Publication Date:
January 25, 2006
Filing Date:
March 31, 2000
Export Citation:
Assignee:
Sony Chemical Co., Ltd.
International Classes:
H01B1/22; C09J5/06; C09J9/02; C09J163/00; H01B1/20; H01B5/16; H01L21/60; H01R11/01; H05K3/32; (IPC1-7): H01B1/20; H01B5/16; H01L21/60
Domestic Patent References:
| JP11317426A | ||||
| JP6260533A | ||||
| JP11241054A | ||||
| JP2000030526A | ||||
| JP5347464A | ||||
| JP11241054A |
Attorney, Agent or Firm:
Noboru Tajime
Tajime Keiko
Tajime Keiko
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