Title:
SEMICONDUCTOR SUBSTRATE ALIGNING DEVICE AND METHOD
Document Type and Number:
Japanese Patent JP3245833
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To align a notch or orientation flat to arbitrary position without contaminating the rear surface of a semiconductor substrate by a method wherein when a spindle means is rotated, the semiconductor substrate held by a holding means is also rotated around its axial line.
SOLUTION: When a pulse motor 4 is driven, four spindles 7 are synchronously rotated via a timing belt 5, and a holding means provided in the spindle 7 is also rotated, and interlocking with this rotation, a semiconductor substrate 9 is rotated thereon around its axial line. When a notch or orientation flat of a semiconductor substrate 9 passes a position of a sensor 6, the sensor 6 detects it, and a signal for rotating only at a revolution speed required for reaching the notch or orientation flat therefrom to a predetermined position is transmitted to the pulse motor 4. Thus, the semiconductor substrate is positioned without coming into contact with a rear face of the semiconductor substrate, and particle contamination disappears on the rear face of the semiconductor substrate by vacuum attraction.
Inventors:
Takayuki Yamagishi
Application Number:
JP21734899A
Publication Date:
January 15, 2002
Filing Date:
July 30, 1999
Export Citation:
Assignee:
Japan ASM Co., Ltd.
International Classes:
H01L21/00; H01L21/68; H01L21/687; (IPC1-7): H01L21/68
Domestic Patent References:
| JP9246357A | ||||
| JP3116039U |
Attorney, Agent or Firm:
Sumio Takeuchi (1 outside)