APPARATUS FOR FIRING CERAMIC SUBSTRATE AND METHOD FOR FIRING CERAMIC SUBSTRATE USING THE SAME

Japanese Patent JP2012096980

A

To provide an apparatus for firing a ceramic substrate, and to provide a method for firing a ceramic substrate using the same.

The apparatus for firing a ceramic substrate includes: a firing setter for mounting a ceramic substrate thereon; a firing pressing plate located at an upper part of the ceramic substrate; and ceramic supporting columns which are arranged between the firing setter and the firing pressing plate so that a certain interval may be formed between the firing pressing plate and the ceramic substrate and each has a thickness shrinkage during firing larger than that of the ceramic substrate. When a large ceramic substrate is fired under pressure, the ceramic substrate is fired without causing warp by using the ceramic columns each having a shrinkage higher than that of the ceramic substrate and the firing pressing plate.

WO/2021/064036	POLYCRYSTALLINE CERAMIC SOLID, DIELECTRIC ELECTRODE COMPRISING THE SOLID, DEVICE COMPRISING THE ELECTRODE AND METHOD OF PRODUCTION
WO/2003/000610	COMBUSTION AID FOR THE THERMAL TREATMENT OF PRODUCTS CONSISTING OF DIFFERENT MATERIALS AT BAKING TEMPERATURES AND METHOD FOR THE PRODUCTION OF THE SAME

CHO BEOM-JOON
PARK YUN HWI
LYOO SOO-HYUN

JP2011050192A

May 24, 2012

March 08, 2011

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SAMSUNG ELECTRO MECH

C04B35/64; F27D3/12; F27D5/00

JP2005306672A	2005-11-04
JPH04144970A	1992-05-19
JPH0967169A	1997-03-11
JPS5832075A	1983-02-24
JPS62128973A	1987-06-11
JPH10291865A	1998-11-04

Konobu Kato
Takafumi Oshima

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