Title:
APPARATUS AND METHOD FOR APPLYING RESIST
Document Type and Number:
Japanese Patent JP2003309063
Kind Code:
A
Abstract:
To provide a resist applying apparatus and a resist applying method for preventing the resist that is forced out of a semiconductor substrate from adhering onto the side of a reinforcing plate, when applying the resist while the semiconductor substrate is put to the reinforcing plate.
The resist applying apparatus 101 has electromagnets 103a and 103b at the outer periphery section of a chuck section 102 for enabling a sapphire plate 3 where a GaAs substrate 2 is subjected to vacuum suction, and covers the surface of the sapphire plate 3 that is exposed from the GaAs substrate 2 with masks 106 made of a magnetic material for coating the resist.
Inventors:
YOSHIMURA HEIZO
Application Number:
JP2002115804A
Publication Date:
October 31, 2003
Filing Date:
April 18, 2002
Export Citation:
Assignee:
KANSAI NIPPON ELECTRIC
International Classes:
G03F7/16; B05C11/08; B05C13/02; B05D1/40; H01L21/027; (IPC1-7): H01L21/027; B05C11/08; B05C13/02; B05D1/40; G03F7/16