Title:
APPARATUS AND METHOD FOR BONDING DEVICE
Document Type and Number:
Japanese Patent JP3633493
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus and a method for bonding a device for bonding two kinds of devices on a display panel with high accuracy at high speed.
SOLUTION: A first feeding part 71 with a first device P1 and a second feeding part 70b with a second device P2 are provided. A turn table 80 having a first nozzle 84 for picking up the first device P1 and a second nozzle 85 for picking up the second device P2 is provided between the display panel 10 and the first and second feeding parts 70a and 70b. A first head 91a for bonding the first device P1 on the longer side of the display panel 10 while the first device P1 is sucked by vacuum and a second head 91b for bonding the second device P2 on the shorter side of the display panel 10 while the second device P2 is sucked by vacuum are provided between the turn table 80 and the display panel 10.
Inventors:
Onizuka Yasuto
Application Number:
JP2001039854A
Publication Date:
March 30, 2005
Filing Date:
April 28, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP3046244A | ||||
| JP63027030A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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