Title:
APPARATUS AND METHOD FOR CONNECTING PLATES DIFFERENT IN EXPANSION COEFFICIENT
Document Type and Number:
Japanese Patent JP3160339
Kind Code:
B2
Abstract:
PURPOSE: To keep the integrality of two plates even in a case receiving different expansions to make the accurate mechanical connection of them certain by forming an intermediate layer from a large number of thin flexible independent wires equal in length arranged between the opposed surfaces of two plates.
CONSTITUTION: Plates 1, 2 are connected through a transition layer 4 from a large number of discontinuously juxtaposed wires 5 arranged at a right angle. A large number of the wires 5 are formed of a heat conductive material but a large number of slightly deformable rigid segments are formed. When the plates 1, 2 are set to equal temp. T0, the wires 5 extend mutually parallelly. When the plate 1 is raised to temp. T1, a heat flow F is conducted to an assembly and the expansion of the plate 1 becomes larger than that of the plate 2 raised to temp. T2 lower than temp. T1 and the wires 5 expand as a function of expansion difference. This expansion removes the shearing force between the plates 1, 2 and the wires 5 are deformed to a double folded shape having amplitude adaptable to the respective points of the plates and the mutually common heat flow passage in an right-angled direction between two plates is kept.
More Like This:
Inventors:
Jean-Claude Clevan
Application Number:
JP35351791A
Publication Date:
April 25, 2001
Filing Date:
November 16, 1991
Export Citation:
Assignee:
Societe Nacional Deuteyudo e Do Contriyucón Do Motor Davuación, "S.N.U.U.Se.M. Ah."
International Classes:
B21D47/00; B23K1/00; B32B37/00; F02K9/97; F16B5/00; F28F21/02; G21B1/11; F16B1/00; (IPC1-7): B32B31/00
Domestic Patent References:
| JP230678A | ||||
| JP6051420B2 |
Attorney, Agent or Firm:
Aoki Akira (4 outside)