Title:
APPARATUS AND METHOD FOR MOUNTING ELECTRONIC DEVICES
Document Type and Number:
Japanese Patent JP3427620
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting electronic devices capable of mounting works on the base of a stem at a high mounting position accuracy.
SOLUTION: A lead extending back from a lead-attached stem 2 is inserted into a hole of a block to hold the stem 2 horizontally on the block. The stem 2 is pushed up by a pusher 70 to butt it to a stopper 79 and rotated to face its cut grooves 8 at pushers 53, 54 which are then advanced to chuck the stem 2 from right and left, thus correctly positioning the stem 2 and base. After mounting a heat sink of a work feeder on the front base of the stem 2, a light emitting device is mounted on the heat sink.
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Inventors:
Tomoaki Nakanishi
Application Number:
JP15394796A
Publication Date:
July 22, 2003
Filing Date:
June 14, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/52; B23P19/00; H01L31/02; H01L33/62; H01S5/00; H01S5/02; H05K13/02; (IPC1-7): H01L31/02; H01L21/52; H01L33/00; H01S5/02; H05K13/02
Domestic Patent References:
| JP1108790A | ||||
| JP758134A | ||||
| JP5643784A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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