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Title:
AROMATIC POLYCARBONATE RESIN COMPOSITION AND CASE FOR ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2008095046
Kind Code:
A
Abstract:

To provide an aromatic polycarbonate resin composition promoting a reaction of the aromatic polycarbonate resin with other thermoplastic resins and improved in heat resistance/impact resistance, chemical resistance and the like.

The aromatic polycarbonate resin composition comprises 100 pts.mass aromatic polycarbonate resin (A) consisting of 1-100 pts.mass aromatic polycarbonate resin (A-1) having an alcoholic hydroxyl group expressed by general formula (I) in a terminal structure, 99-0 pts.mass aromatic polycarbonate resin (A-2) except the resin (A-1), and 5-200 pts.mass thermoplastic resin (B) except the resin (A). In the formula, R expresses a methylene group, an ethylene group, a 3-20C polymethylene group, a branched alkylene group or a branched alkylidene group and n expresses a 1-5 integer.


Inventors:
HAYATA YUSUKE
OKAMOTO MASAYA
Application Number:
JP2006281607A
Publication Date:
April 24, 2008
Filing Date:
October 16, 2006
Export Citation:
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Assignee:
IDEMITSU KOSAN CO
International Classes:
C08L69/00; C08K5/1515; C08K5/29; C08K5/353; C08L101/00
Domestic Patent References:
JP2006241209A2006-09-14
JPH02245022A1990-09-28
JPH05132552A1993-05-28
JPH06179808A1994-06-28
JP2006182994A2006-07-13
JPH05132552A1993-05-28
JPH06179808A1994-06-28
JP2006182994A2006-07-13
JP2006241209A2006-09-14
JPH02245022A1990-09-28
Attorney, Agent or Firm:
Tamotsu Otani
Masamichi Tohei