Title:
原子層堆積プロセス
Document Type and Number:
Japanese Patent JP2011503876
Kind Code:
A
Abstract:
The invention provides methods for selectively coating a substrate surface comprising a first and a second material with a thin film of a protective material using an atomic layer deposition process.
Inventors:
Dameron, Allerain
Application Number:
JP2010533167A
Publication Date:
January 27, 2011
Filing Date:
October 30, 2008
Export Citation:
Assignee:
HFC Partners Limited Partnership
International Classes:
H01L21/316; C23C16/40; C23C16/44; H01L21/768; H01L23/522
Attorney, Agent or Firm:
Haruo Hamada