Title:
AUXILIARY HEATING PLATE
Document Type and Number:
Japanese Patent JP2001196322
Kind Code:
A
Abstract:
To provide an auxiliary heating plate which is capable of lessening a temperature difference between the peripheral part and center of a semiconductor wafer so as to uniformly heat the semiconductor wafer, holding it in a light irradiation-type thermal treatment device in which temperature is measured with an optical pyrometer.
An auxiliary heating plate 2 is built in a light irradiation-type thermal treatment device, where the heating plate 2 is formed of ceramic material which is of light transmissivity 0.1% or below to light rays of wavelength 0. 7 to 1.2 μm.
Inventors:
ANDO AKIRO
ENDO HIDEHIRO
ENDO HIDEHIRO
Application Number:
JP2000002114A
Publication Date:
July 19, 2001
Filing Date:
January 11, 2000
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
C04B35/581; F27D3/12; F27D5/00; H01L21/205; H01L21/26; (IPC1-7): H01L21/26; C04B35/581; F27D3/12; F27D5/00; H01L21/205
Attorney, Agent or Firm:
Tomoyuki Yathata (1 outside)
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