Title:
BALL GRID ARRAY
Document Type and Number:
Japanese Patent JP3800705
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a ball grid array, which is superior in the reliability of the electrical connection of a multitude of solder balls with via holes.
SOLUTION: A multitude of solder balls 1 for bonding to an opposite member constitute a solder ball arrangement group 10 with the outermost periphery arranged into a polygonal shape on the surface of an insulating board 7. The solder balls at least the corner parts 101 on the outermost periphery are offset layout balls 11 bonded at positions shifted from the centers of the via holes and the balls 11 and the via holes are connected electrically with each other through a conductor circuit. The solder balls 1 excluding the layout balls 11 are onset layout balls 12 bonded to the center positions of via holes and the layout balls 12 and the via holes are electrically connected with each other through metal-plated films covering the inner walls of the via holes.
Inventors:
Teruyo Tsukada
Cormorant fishing
Cormorant fishing
Application Number:
JP3296497A
Publication Date:
July 26, 2006
Filing Date:
January 31, 1997
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H01L23/12; H05K3/46; (IPC1-7): H01L23/12; H05K3/46
Domestic Patent References:
| JP9321172A | ||||
| JP6510396A | ||||
| JP8004607A | ||||
| JP9036172A | ||||
| JP9307023A |
Attorney, Agent or Firm:
Yoshiyasu Takahashi
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