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Title:
BALL JOINT STRUCTURE
Document Type and Number:
Japanese Patent JP2010181027
Kind Code:
A
Abstract:

To provide a ball joint structure, capable of reducing an occupied space by protecting a wire rod in a ball joint.

The ball joint structure 100 includes: a socket 110 having a socket upper lid 112 having a housing opening part and a socket lower lid 114 engaged with the socket upper lid 112; a ball part 130 disposed within the socket 110 while including the socket upper lid 112 and the socket lower lid 114 engaged with the socket upper lid 112; an elastic housing lid disposed within the housing opening part and contacting with the ball part 130; and a plurality of variable elastic screws 150 screwed to the socket 110 to provide a holding force for closely fitting the ball part 130 to the socket 110.


Inventors:
HSIA MING-HUNG
LEE CHEN-CHENG
WANG YO-JUNG
Application Number:
JP2009107149A
Publication Date:
August 19, 2010
Filing Date:
April 24, 2009
Export Citation:
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Assignee:
AVERMEDIA INFORMATION INC
International Classes:
F16C11/06; G03B17/56; H04N5/222; H04N5/225
Domestic Patent References:
JPS6191618U1986-06-13
JPH01112137U1989-07-27
Attorney, Agent or Firm:
Tadao Hirata



 
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